Business overview

Devicesolution

In addition to base materials for semiconductor devices and materials for LCD module equipment, we provide production process materials, processed products, and assembly products.

Device solution事業

Example of delivered components

Modules

  • 3D-MID molded products
  • FPC and ASSY
  • Substrates
  • Silicone
  • Precision coil
  • Precision press
  • Potting agent

Sensors

  • Glass lens
  • Fluorine coating material

Circuit boards

  • Substrate material
  • Plating solution

Semiconductor package

  • CMP slurries
  • Photosensitive PI
  • Die bonding agent
  • Sealing resin material
SHIMODA KOGYO CO., LTD.
3-3-6 Utajima Nishiyodogawa-ku Osaka-city Osaka 555-0021
PH +81 6-6472-1541
FAX +8106-6473-2455